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Ceva and Mobilint advance on-device AI with REGULUS semiconductor technology

Ceva and South Korean semiconductor company Mobilint have announced the integration of advanced artificial intelligence processing technology into the REGULUS edge AI system-on-chip, enabling real-time AI capabilities in power-constrained devices.

Announced on 2 November 2026, the development marks the first production deployment of Ceva’s NeuPro neural processing unit (NPU) family.

Mobilint has incorporated Ceva’s NeuPro-Nano NPU and SensPro AI digital signal processor (DSP) into its REGULUS semiconductor platform, designed to support AI applications across robotics, drones, machine vision, smart cameras and connected devices.

Bringing AI processing closer to devices

The REGULUS system-on-chip delivers 10 trillion operations per second (TOPS) of AI processing performance while consuming less than 3 watts of power.

Supporting up to 8GB of memory, the processor is designed to handle demanding AI workloads directly on devices, reducing reliance on remote cloud infrastructure.

Its multi-engine architecture distributes workloads between specialised processing components.

Ceva’s SensPro AI DSP handles sensing and signal-processing tasks, while its NeuPro-Nano NPU supports neural network processing and continuous AI inference.

Together, the technologies enable devices to process information and respond to their surroundings locally and in real time.

Supporting robotics and industrial applications

The technology is intended for applications where low power consumption, compact hardware and rapid response times are essential.

These include autonomous robotics, industrial machine vision, intelligent cameras, drones and Internet of Things (IoT) devices.

Dongjoo Shin, Chief Executive Officer of Mobilint, said the combination of specialised processing technologies enables sophisticated AI workloads to operate directly on devices within strict power limitations.

REGULUS is already being used in commercial products, including Mobilint’s MLD-R1 AI USB accelerator, which was first previewed at COMPUTEX 2026 and is now shipping.

The accelerator enables existing systems to incorporate local AI processing for computer vision, video analytics and generative AI applications.

Potential deployments include smart factories, robotics, security systems, medical devices and digital signage.

Expanding commercial edge AI technology

For Ceva, the integration represents an important milestone in bringing its NeuPro NPU technology into commercial semiconductor production.

Yaron Galitzky, Executive Vice President and General Manager of Ceva’s AI Division, said the REGULUS deployment demonstrates the company’s progress in delivering AI processing technology for commercial silicon.

The announcement reflects continued development in edge computing, where more AI processing is performed directly within devices rather than exclusively through centralised cloud infrastructure.

By combining sensing, signal processing and AI inference within a compact, energy-efficient platform, Ceva and Mobilint aim to support the growing requirements of intelligent connected systems across industrial and commercial applications.